Die stack with cascade and vertical connections

ABSTRACT

An electronic assembly includes a plurality of electronic die arranged into shingles, each shingle having a multiple offset stacked die coupled by cascading connections. Each shingle is arranged in a stack of shingles with alternate shingles having die stacked in opposite directions and offset in a zigzag manner to facilitate vertical electrical connections from a top of the electronic assembly to a bottom die of each shingle.

PRIORITY APPLICATION

This patent application is a continuation of U.S. application Ser. No.15/780,506, filed May 31, 2018, which is a U.S. National StageApplication under 35 U.S.C. 371 from International Application No.PCT/US2015/063346, filed Dec. 2, 2015, published as WO 2017/095401, allof which are incorporated herein by reference in their entirety.

TECHNICAL FIELD

Embodiments described herein generally relate to stacked die packages,and more particularly to overlapping stacked die packages that includeconductive columns.

BACKGROUND

Mobile products (e.g., mobile phones, smart phones, tablet computers,etc.) are very restricted in available space because there are typicallysevere limitations for chip/package area and height (among otherphysical and electrical parameters). Therefore, it is extremelyimportant to reduce the size of electronic components (e.g., packagedchips or discrete devices, integrated passive devices (IPDs), surfacemount devices (SMDs), etc.) on a system board (e.g., printed circuitboard PCB).

Conventional stacked electronic components typically require. relativelylarge z-height making them more difficult to fit inside a housing ofmobile products, especially when several chips, IPDs or SMDs need to beassembled and/or stacked one on top of another. In addition, as withmost electronic components, there is usually a goal of improvedelectrical performance.

There are two existing packaging methods for high die count stacked diepackages. One method forms a wire bond based package in which substrateand over mold add extra z-height to the package. In addition, wire bondbased packages are also typically limited in their performance becauseof the number and length of the wires that are utilized in the packages.

Another existing packaging method for high die count stacked diepackages utilizes Thru Silicon Via (TSV) technology. High die countstacked die packages that utilize TSV usually have relatively highspeed. However, z-height reduction is still difficult with TSV. Inaddition, the vias that are formed using TSV technology often use upvaluable space on silicon. There are also usually relatively highmanufacturing costs that are associated with utilizing TSV technologymaking it more expensive to produce high die count stacked die packagesusing TSV technology. The typical z-height of a conventional 16 Die BOAstacked die package is 1.35 mm where each die is thinned to 35 um.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a side view of a shingle having multiple offset stacked dieaccording to an example embodiment.

FIG. 2 is a side view of the shingle of FIG. 1 with cascade wirebondsbetween adjacent die in the shingle according to an example embodiment.

FIG. 3 is a side view of two shingles with cascade wirebonds arranged ina zig-zag pattern according to an example embodiment.

FIG. 4 is a side view of three shingles with cascade wirebonds arrangedin a zig-zag pattern according to an example embodiment.

FIG. 5 is a side view of four shingles with cascade wirebonds arrangedin a zig-zag pattern according to an example embodiment.

FIG. 6 is a side view of the four shingles of FIG. 5 with verticalwirebonds extending from a top bonding surface to a bottom die in eachshingle according to an example embodiment.

FIG. 7 is a side view of the four shingles of FIG. 6 including a moldingformed around the shingles and wirebonds according to an exampleembodiment.

FIG. 8 is a side view of the four shingles of FIG. 7 with bondingmaterial removed and including a redistribution layer coupled to thevertical wirebonds according to an example embodiment.

FIG. 9 is block diagram of an electronic apparatus that includes theelectronic assemblies and/or the electronic packages described herein.

FIG. 10 is a flowchart illustrating a method of forming a zigzag stackof die shingles according to an example embodiment.

DESCRIPTION OF EMBODIMENTS

The following description and the drawings sufficiently illustratespecific embodiments to enable those skilled in the art to practicethem. Other embodiments may incorporate structural, logical, electrical,process, and other changes. Portions and features of some embodimentsmay be included in, or substituted for, those of other embodiments.Embodiments set forth in the claims encompass all available equivalentsof those claims.

Orientation terminology, such as “horizontal,” “x” or “y” as used inthis application is defined dimensions and directions with respect to aplane parallel to the conventional plane or surface of a wafer orsubstrate, regardless of the orientation of the wafer or substrate. Theterm z-height, refers to a direction perpendicular to the horizontal asdefined above. Prepositions, such as “on,” “side” (as in “sidewall”),“higher,” “lower,” “over,” and “under” are defined with respect to theconventional plane or surface being on the top surface of the wafer orsubstrate, regardless of the orientation of the wafer or substrate.

The electronic assemblies, packages and methods described herein mayaddress the drawbacks that are associated with using wire bond packagingtechnology and TSV technology to form high die count stacked diepackages. In addition, electronic assemblies, packages and methodsdescribed herein may increase the electrical performance of high diecount stacked die packages.

The electronic assemblies, packages and methods described herein mayprovide some benefits over using conventional TSV technology to formhigh die count stacked die packages.

The silicon utilization efficiency of the electronic assemblies,packages and methods described herein may be higher than TSV technologybecause TSV technology fabricates vias through peripheral areas ofsilicon. This need to fabricate openings in the silicon to createopenings for via formation uses valuable space on the silicon andincreases the fabrication costs associated with forming high die countstacked die packages. The electronic assemblies, packages and methodsdescribed herein do not require any type of fabrication to createopenings in the silicon for vias.

The electronic assemblies, packages and methods described herein mayutilize existing wire bond equipment to create conductive columns tocouple zig-zag stacked shingles of die. This ability to use existingwire bond equipment may reduce the costs that are associated withfabricating the electronic assemblies, packages and methods describedherein.

The electronic assemblies, packages and methods described herein mayprovide improved electrical performance. The overall package size may bereduced because (i) the X-Y space on the substrate that is usually usedfor wire bonding may be saved and the extra over molding that werepreviously used for the conductive wires that are used in wire bondingmay be eliminated to reduce the z-height. The electrical performance maybe better because the conductive columns are shorter based on thezig-zag arrangement of shingles and the use of cascade connectionsbetween die in each shingle. Shorter conductive columns result in lessoverall wire length, saving on cost of precious metals utilized formetal wirebonding.

Stacks of staggered die are used to form multiple shingles. The shinglesare stacked and offset from each other in a zig-zag manner to allowformation of vertical connections to a bottom die on each shingle.Cascade connections may be used to connect adjacent die in each shingle.The use of the zig-zag stacking of shingles, vertical connections, andcascade connections allows larger stacks of die while minimizing ay-dimension. The term “vertical connections” refers to a connection thatgenerally traverses a z-height but may also have an x or y-dimensioncomponent. Such a vertical connection need not be perpendicular and ifformed by wirebonding, will generally have some angle to perpendicularat least partially depending on the length of the resulting connection.In some embodiments, one or more shingles includes one or more die. If ashingle has one die, cascade connections may optionally not be utilized.

FIGS. 1-8 are side views illustrating a method of stacking andconnecting die and shingles. Reference numbers are used for the sameelements in each of FIGS. 1-8. FIG. 1 is a side view of a shingle 100having multiple offset stacked die 110, 115, 120, and 125 according toan example embodiment. While four die are shown in each shingle, andfour shingles are shown, the number of such die and shingles may varyallowing stacks of die up to and exceeding 32 die. The die may also beof varying thickness, corresponding to a z-direction. The side viewillustrates a y-direction of the stack of shingles. The stacked die aresupported by a carrier 130 to provide a solid platform for handlingduring formation of the shingle.

The die 110, 115, 120, and 125 are staggered in one embodiment such thata suitable area of each die is exposed on a top surface to facilitateformation of connections 210, 215, and 220 as illustrated in FIG. 2. Theexposed area, referred to as a stagger distance, may be limited in sizeso as to allow such connections to be made in a reliable manner yetminimizing a total y-direction dimension. In one embodiment, a standardwirebonding method may be used to form the connection 210, 215, and 220in a cascade manner. The connections may be referred to as cascadeconnections that connect adjacent die 110, 115, 120, and 125 in ashingle 100 to each other. Note that there may be multiple such cascadeconnections extending in an x-direction between each adjacent die, allas represented by connections 210, 215, and 220 and other connectionsshown in further figures.

FIG. 3 is a side view of two shingles 100 and 300 with cascade wirebonds210, 215, and 220, and 310, 315, and 320 respectively arranged in azig-zag pattern according to an example embodiment. The zig-zag patternis exemplified by the shingle 300 comprising multiple staggered stackeddie with the stagger being in the opposite direction of the stagger ofdie in shingle 100. Further, the shingle 300 is offset. The amount ofshingle offset is related to the number of shingles in the finalpackage, to allow vertical connections to be formed to a bottom die ofeach shingle. The purpose and amount of adjacent shingle offsetdecreases with each additional shingle as illustrated in succeedingfigures. In one embodiment, the shingle offset is a multiple of thestagger distance and related to the amount of area suitable for formingvertical connections.

FIG. 4 is a side view of three shingles 100, 300, and 400 with cascadewirebonds arranged in a zig-zag pattern according to an exampleembodiment. Shingle 400 is stacked on top of shingle 300 with exposeddie due to staggering occurring opposite that of the exposed die ofshingle 300, but the same as that in shingle 100. Thus, the staggeringis opposite for adjacent shingles. Shingle 400 is also offset frontshingle 100 by a reduced amount. Note that amount of shingle offset is afunction of the total number of shingles to be stacked. With a largernumber of shingles, a larger initial shingle offset is used than with afour shingle stack, with the offset decreasing for each additionalshingle.

Using the zigzag stacking of shingles, a y-dimension growth of (T/S)xO,where T is the total number of die, S is the number of die per shingle,and O is the overhang (also referred to as the stagger distance above)may be obtained. Note that in some embodiments, S may vary from one tofour or more. In prior methods of utilizing wirebonding on a singlelarge stack of die, the y-dimension growth is simply TxO, which may bemuch larger than that obtained with the zigzag stacking of shingles.

FIG. 5 is a side view of four stacked shingles 100, 300, 400 and 500with cascade wirebonds arranged in a zig-zag pattern according to anexample embodiment. Shingle 500 is stacked on top of shingle 400 withexposed die due to staggering occurring opposite that of the exposed dieof shingle 400, but the same as that in shingle 300. Thus, thestaggering is opposite for adjacent shingles. Shingle 500 is also offsetfrom shingle 100 by a reduced amount. As seen in FIG. 5, each shinglehas bottom die that is exposed in a manner suitable for forming avertical connection.

To optimize z-dimension utilization, the shingle offsets of the zigzagstack result in a single stagger distance of each bottom die of eachshingle being exposed for vertical connection. In FIG. 5, such a zigzagstagger is illustrated by the right most side of the bottom die ofshingle 100 being exposed for vertical connection, due to shingle 400being offset one stagger distance to the left of the right most side ofshingle 100. Shingle 500 is also offset, allowing vertical access to theright most die of shingle 400. The same offsets operate to expose theleft sides of shingle 300, with successive shingles having decreasingoffsets to provide such exposures and allow vertical connections to bemade to the bottom die of each shingle.

FIG. 6 is a side view of the four shingles of FIG. 5 with verticalwirebonds extending from a top bonding surface to a bottom die in eachshingle according to an example embodiment. In one embodiment, a dummybonding surface 600 may be formed on top of or otherwise supported bythe top shingle 500. Wirebonds may be formed to the bottom die of eachshingle using a standard wirebonding process. On the right side of thezigzag shingle stack, wires are formed to the vertically exposed bottomdie of shingle stacks that are staggered with vertically exposedshingles. A wire 610 is formed extending to an exposed area 615 of thebottom die of shingle 400. A wire 620 is formed extending to an exposedarea 625 of the bottom die of shingle 100. On the left side of thezigzag shingle stack, wires are formed to the vertically exposed bottomdie of shingle stacks that are staggered with vertically exposedshingles. A wire 630 is formed extending to an exposed area 635 of thebottom die of shingle 500. A wire 640 is formed extending to an exposedarea 645 of the bottom die of shingle 300.

FIG. 7 is a side view of the four shingles of FIG. 6 including a molding700 formed around the shingles and wirebonds according to an exampleembodiment. As an example, the mold 700 may surround the package shinglestack and be formed of a thermoset molding compound, such as an epoxy(among other types of materials).

FIG. 8 is a side view of the four shingles of FIG. 7 forming package 800with some bonding material 700 removed and the carrier 130 alsooptionally removed. The remaining bonding material 810 helps support andprotect the stacked shingles. The dummy bonding surface 600 has alsobeen removed. Grinding may be used for such removal in some embodimentsto expose the top die of the top shingle 500. A redistribution layer 820may be formed and coupled to the vertical wirebonds to provide desiredelectrical connections via the vertical wirebonds, cascade wirebondconnections and conduction paths on individual die to form the package800.

Note that the vertical connections created by the vertical wirebonds maynot have as high of an aspect ratio as shown in the FIGs., as they arenot drawn to scale. An example aspect ratio of the vertical columns mayrange from 1 to 20 or higher and may vary along their length, especiallywhen wirebonding is used to form the columns. Vertical columns extendingto different die of different shingles may have different aspect ratios.A higher aspect ratio may be desired to minimize the length of package800, as a higher aspect ratio may allow shorter y-dimension stagger andoffset distances.

In a further embodiment, the mold 700 may be formed prior to formationof the vertical columns. Vias may then be formed through the mold, suchas by drilling, and filled with conductive material to form verticalcolumns with very high aspect ratios. In some embodiments, the die towhich the vertical columns are coupled may have conductive pads tofacilitate the electrical connection to the columns. The columns mayhave a circular cross section in one embodiment, or may have a polygonshape in further embodiments.

An electronic apparatus 900 may include one or more packages 800 thatmay be bonded together. Examples of an electronic apparatus include, butare not limited to, personal computers, tablet computers, mobiletelephones, game devices, MP3 or other digital music players, etc. Inthis example, electronic apparatus 900 comprises a data processingsystem that includes a system bus 902 to couple the various componentsof the electronic apparatus 900. System bus 902 provides communicationslinks among the various components of the electronic apparatus 900 andmay be implemented as a single bus, as a combination of busses, or inany other suitable manner.

An electronic apparatus 900 as described herein may be coupled to systembus 902. The electronic apparatus 900 may include any circuit orcombination of circuits. In one embodiment, the electronic apparatus 900includes a processor 912 which can be of any type. As used herein,“processor” means any type of computational circuit, such as but notlimited to a microprocessor, a microcontroller, a complex instructionset computing (CISC) microprocessor, a reduced instruction set computing(RISC) microprocessor, a very long instruction word (VLIW)microprocessor, a graphics processor, a digital signal processor (DSP),multiple core processor, or any other type of processor or processingcircuit.

Other types of circuits that may be included in electronic apparatus 900are a custom circuit, an application-specific integrated circuit (ASIC),or the like, such as, for example, one or more circuits (such as acommunications circuit 914) for use in wireless devices like mobiletelephones, tablet computers, laptop computers, two-way radios, andsimilar electronic systems. The IC can perform any other type offunction.

The electronic apparatus 900 may also include an external memory 920,which in turn may include one or more memory elements suitable to theparticular application, such as a main memory 922 in the form of randomaccess memory (RAM), one or more hard drives 924, and/or one or moredrives that handle removable media 926 such as compact disks (CD), flashmemory cards, digital video disk (DVD), and the like.

The electronic apparatus 900 may also include a display device 916, oneor more speakers 918, and a keyboard and/or controller 930, which caninclude a mouse, trackball, touch screen, voice-recognition device, orany other device that permits a system user to input information intoand receive information from the electronic apparatus 900.

FIG. 10 is a flowchart illustrating a method 1000 of forming a zigzagstack of die shingles according to an example embodiment. Method 1000begins by stacking die at 1010 on top of a carrier to form a firstshingle of offset die. At 1015, connections between the die of the firstshingle are formed. In one embodiment, the connections are cascadeconnections formed using wirebonding between exposed portions ofadjacent die in the shingle. The die may be stacked in a staggeredmanner to facilitate the inter-die connections. At 1020, additional dieare stacked to form a second shingle of offset die.

At 1025, the second shingle is stacked on top of the first shingle suchthat the die are offset or staggered in opposite directions and thesecond shingle is offset from the first shingle an amount large enoughto enable further shingles to be stacked with decreasing offsets. At1030, cascade connections are formed between the die of the secondshingle.

At 1035, multiple additional shingles may be stacked with decreasingoffset and forming connections between die of the shingles, Verticalconnections to the bottom die of each shingle may be formed at 1040. At1045, a mold may be formed around the stack and a top of the mold may beremoved at 1050 down to a top level die. Optionally, the verticalcolumns may be formed after forming the mold such as by drilling andfilling with conductive material. A redistribution layer supported bythe stack of shingles may be formed at 1055 to couple to the verticalconnections. The carrier supporting the stack may also be removed at1060.

To better illustrate the electronic assemblies, electronic packages andmethods disclosed herein, a non-limiting list of examples is providedherein:

Example 1 includes an electronic assembly that includes a plurality ofelectronic die arranged into shingles. Each shingle has multiple offsetstacked die coupled by cascading connections. Each shingle is arrangedin a stack of shingles with alternate shingles having die stacked inopposite directions and offset in a zigzag manner to facilitate verticalelectrical connections from a top of the electronic assembly to a bottomdie of each shingle.

Example 2 includes the electronic assembly of example 1, wherein thezigzag manner of stacking shingles continue a pattern of decreasingoffsets facilitating alternating opposite vertical connections to thebottom die of each successive shingle.

Example 3 includes the electronic assembly of any one of examples 1-2,wherein a y-dimension growth of the electronic assemble is defined by(T/S)*O, where T is the total number of die, S is the number of die pershingle, and O is the overhang of each die and offset of each shingle.

Example 4 includes the electronic assembly of example 3 wherein S is atleast four.

Example 5 includes the electronic assembly of any of examples 3-4wherein there are at least four shingles.

Example 6 includes an electronic assembly including a plurality ofoffset zigzag shingle stacks of die such that a portion of each bottomdie in each shingle stack die is vertically exposed. A plurality ofcascade electrical connections extend between adjacent die in eachshingle stack. A plurality of vertical connections are coupled to thevertically exposed portions of the bottom die of each shingle stack.

Example 7 includes the electronic assembly of example 6 whereiny-dimension growth of the electronic assemble is defined by (T/S)*O,where T is the total number of die, S is the number of die per shingle,and O is the overhang of each die and offset of each shingle.

Example 8 includes an electronic assembly including a first shinglehaving multiple stacked offset die coupled via wirebonds on a first endof the first shingle. A second shingle is supported by the first shingleand has multiple stacked offset die coupled via wirebonds on a first endof the second shingle opposite the first end of the first shingle. Anelectrical redistribution layer is supported by the second shingle.Multiple conductive vertical columns couple the redistribution layer tothe first and second shingles on the first ends of the shingles.

Example 9 includes the electronic assembly of example 8 and furtherincludes multiple additional shingles supported by the first and secondshingles, each of the multiple additional shingles having multiplestacked offset die coupled via wirebonds on one end and conductivevertical columns on another end such that all the shingles are arrangedin a zig-zag pattern, each extending in a y-direction sufficient to makeroom for at least one vertical column.

Example 10 includes the electronic assembly of example 9 wherein eachshingle comprises at least four die offset from each other a distancesufficient to facilitate top side cascade bonds between adjacent die.

Example 11 includes the electronic assembly of example 9 whereinadjacent shingles have die offset in opposite directions.

Example 12 includes the electronic assembly of example 11 wherein dieare offset from each other a distance sufficient to facilitate top sidecascade bonds between adjacent die, and wherein alternate shingles areoffset from other shingles a distance sufficient to facilitate avertical wire bond to the redistribution layer.

Example 13 includes the electronic assembly of example 12 wherein theoffset of the die and shingles from each other are minimized to reducethe Y dimension of the electronic assembly yet still facilitate therespective wirebonds.

Example 14 includes the electronic assembly of any of examples 7-12 andfurther includes a mold surrounding the vertical conductive columnsbetween the redistribution layer and the shingles.

Example 15 includes the electronic assembly of example 14 wherein theconductive vertical columns are through mold vias.

Example 16 includes the electronic assemble of any of examples 7-12wherein shingle has multiple vertical conductive columns extending in anx-direction without increasing the y-dimension, such multiple verticalcolumns coupled to the redistribution layer.

Example 17 includes the electronic assembly of any of examples 8-13,wherein the conductive vertical columns have a cylindrical cross sectionformed by wirebonding.

Example 18 includes an electronic assembly including a first shinglehaving multiple stacked offset die coupled via wirebonds on a first endof the first shingle. A second shingle is supported by the first shingleand has multiple stacked offset die coupled via wirebonds on a first endof the second shingle opposite the first end of the first shingle. Anelectrical redistribution layer is supported by the second shingle. Ameans is provided for coupling the redistribution layer to the first andsecond shingles on second ends of the shingles opposite the first endsof the shingles.

Example 19 includes the electronic assembly of example 18 wherein theoffset of the die and shingles from each other are minimized to reducethe Y dimension of the electronic assembly.

Example 20 is a method including stacking die to form a first shingle ofoffset die, forming connections between the die of the first shingle,stacking die to form a second shingle of offset die, stacking the secondshingle on top of the first shingle such that the die offset in oppositedirections and the second shingle is offset from the first shingle anamount large enough to enable further shingles to be stacked withdecreasing offsets, and forming connections between the die of thesecond shingle.

Example 21 includes the method of example 20 and further includesstacking multiple additional shingles with decreasing offset and formingconnections between die of the shingles.

Example 22 includes the method of example 21 and further includingforming vertical connections to the bottom die of each shingle.

Example 23 includes the method of example 22 and further includesforming a redistribution layer supported by the stack of shingles tocouple to the vertical connections.

Example 24 includes the method of example 23 and further includesremoving a carrier supporting the stack.

Example 25 includes the method of any of examples 20-24 and furtherincludes forming a mold around the stack.

Example 26 includes the method of example 25 and further includesremoving a top of the mold down to a top level die.

Example 27 includes the method of example 26 and further includesforming a redistribution layer on top of the stack of shingles and thevertical connections.

Example 28 includes a method of increasing integrated circuit diedensity in a package. The method includes forming multiple shingles ofdie, each shingle comprising multiple stacked die that are staggered tofacilitate inter-die connections, and stacking the shingles such that adirection of die stagger of each adjacent shingle is opposite each otherand wherein the stacked shingles are offset from each other a distanceto facilitate vertical connections to a bottom die of each shingle.

Example 29 includes the method of example 28 and further includesforming vertical connections to the bottom die of each shingle, forminga mold about the vertical connections, and forming a redistributionlayer supported by the stack of shingles.

Example 30 includes the method of example 29 and further includeselectrically coupling the redistribution layer to the verticalconnections.

Example 31 includes the method of any of examples 28-30 wherein formingmultiple shingles of die comprising forming inter-die connectionsbetween adjacent die of each shingle prior to adding a further shingleto the stack of shingles.

Example 32 is an electronic assembly that includes a plurality ofelectronic die arranged into shingles, each shingle having at least onedie. Each shingle is arranged in a stack of shingles with alternateshingles offset in a zigzag manner to facilitate vertical electricalconnections from a top of the electronic assembly to a bottom die ofeach shingle. The zigzag manner of stacking shingles forms a pattern ofdecreasing offsets facilitating alternating opposite verticalconnections to the bottom die of each successive shingle.

Example 33 includes the electronic assembly of example 32 wherein theoffset of shingles from each other is minimized to reduce the Ydimension of the electronic assembly yet still facilitate the verticalconnections,

This overview is intended to provide non-limiting examples of thepresent subject matter. It is not intended to provide an exclusive orexhaustive explanation. The detailed description is included to providefurther information about the methods.

The above detailed description includes references to the accompanyingdrawings, which form a part of the detailed description. The drawingsshow, by way of illustration, specific embodiments in which theinvention can be practiced. These embodiments are also referred toherein as “examples.” Such examples can include elements in addition tothose shown or described. However, the present inventors alsocontemplate examples in which only those elements shown or described areprovided. Moreover, the present inventors also contemplate examplesusing any combination or permutation of those elements shown ordescribed (or one or more aspects thereof, either with respect to aparticular example (or one or more aspects thereof), or with respect toother examples (or one or more aspects thereof) shown or describedherein.

In this document, the terms “a” or “an” are used, as is common in patentdocuments, to include one or more than one, independent of any otherinstances or usages of “at least one” or “one or more.” In thisdocument, the term “or” is used to refer to a nonexclusive or, such that“A or B” includes “A but not B,” “B but not A,” and “A and B,” unlessotherwise indicated. In this document, the terms “including” and “inwhich” are used as the plain-English equivalents of the respective terms“comprising” and “wherein.” Also, in the following claims, the terms“including” and “comprising” are open-ended, that is, a system, device,article, composition, formulation, or process that includes elements inaddition to those listed after such a term in a claim are still deemedto fall within the scope of that claim. Moreover, in the followingclaims, the terms “first,” “second,” and “third,” etc. are used merelyas labels, and are not intended to impose numerical requirements ontheir objects.

The above description is intended to be illustrative, and notrestrictive. For example, the above-described examples (or one or moreaspects thereof) may be used in combination with each other. Otherembodiments can be used, such as by one of ordinary skill in the artupon reviewing the above. description.

The Abstract is provided to comply with 37 C.F.R. § 1.72(b), to allowthe reader to quickly ascertain the nature of the technical disclosure.It is submitted with the understanding that it will not be used tointerpret or limit the scope or meaning of the claims.

Also, in the above Detailed Description, various features may be groupedtogether to streamline the disclosure. This should not be interpreted asintending that an unclaimed disclosed feature is essential to any claim.Rather, inventive subject matter may lie in less than all features of aparticular disclosed embodiment. Thus, the following claims are herebyincorporated into the Detailed Description, with each claim standing onits own as a separate embodiment, and it is contemplated that suchembodiments can be combined with each other in various combinations orpermutations. The scope of the invention should be determined withreference to the appended claims, along with the full scope ofequivalents to which such claims are entitled.

1. An electronic assembly, comprising: a first shingle having multiplestacked offset die coupled via wirebonds on a top side and a first endof the first shingle; a second shingle stacked on the first shinglehaving multiple stacked offset die coupled via wirebonds on a top sideand a first end of the second shingle opposite the first end of thefirst shingle; an electrical redistribution layer over the top side ofthe second shingle; and multiple conductive vertical connectionsdirectly coupled between the redistribution layer and only one die ineach of the first and second shingles.
 2. The electronic assembly ofclaim 1, wherein each shingle comprises at least four dies.
 3. Theelectronic assembly of claim 1, wherein the multiple conductive verticalconnections include wirebond connections.
 4. The electronic assembly ofclaim 1, wherein the conductive vertical connections include throughmold vias.
 5. The electronic assembly of claim 1, further comprising amold surrounding the conductive vertical connections between theredistribution layer and the shingles.
 6. An electronic assemblycomprising: a plurality of electronic die arranged into shingles, eachshingle having a multiple offset stacked die coupled by cascadingconnections; and a plurality of direct conductive vertical connectionsonly between the bottom die of each shingle to a top surface of anovermold of the electronic assembly.
 7. The electronic assembly of claim6, wherein the cascading connections include wirebond connections. 8.The electronic assembly of claim 6, further comprising an electricalredistribution layer over the top surface of the overmold.
 9. Theelectronic assembly of claim 6, wherein the multiple conductive verticalconnections include wirebond connections.
 10. The electronic assembly ofclaim 6, wherein the conductive vertical connections include throughmold vias.
 11. An electronic assembly comprising: a plurality ofelectronic die arranged into shingles, each shingle having a multipleoffset stacked die coupled by cascading connections, the shinglesarranged in a stack of shingles; a plurality of direct conductivevertical connections only between the bottom die of each shingle to atop surface of an overmold of the electronic assembly; wherein a shingleoffset between shingles decreases with increasing height of the stack ofshingles.
 12. The electronic assembly of claim 11, wherein the stack ofshingles includes four stacked shingles.
 13. The electronic assembly ofclaim 12, wherein each shingle comprises at least four dies.
 14. Theelectronic assembly of claim 13, wherein the cascading connectionsinclude wirebond connections.
 15. The electronic assembly of claim 11,further comprising an electrical redistribution layer over the topsurface of the overmold.
 16. The electronic assembly of claim 11,wherein the multiple conductive vertical connections include wirebondconnections.
 17. The electronic assembly of claim 11, wherein theconductive vertical connections include through mold vias.